Low-Cost Nanostructures from Nanoparticle-Assisted Large-Scale Lithography Significantly Enhance Thermal Energy Transport across Solid Interfaces-Reference-Cited by-同舟云学术

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Low-Cost Nanostructures from Nanoparticle-Assisted Large-Scale Lithography Significantly Enhance Thermal Energy Transport across Solid Interfaces

Published:2018-09-13 Issue:40 Volume:10 Page:34690-34698
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Lee Eungkyu^ORCID,Menumerov Eredzhep,Hughes Robert A.,Neretina Svetlana^ORCID,Luo Tengfei^ORCID

Funder

Defense Advanced Research Projects Agency

University of Notre Dame

Office of Naval Research

Division of Civil, Mechanical and Manufacturing Innovation

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.8b08180

Reference56 articles.

1. High-Brightness InGaN Blue, Green and Yellow Light-Emitting Diodes with Quantum Well Structures

2. AlGaN/GaN HEMTs-an overview of device operation and applications

3. Nanoscale thermal transport

4. Nanoscale thermal transport. II. 2003–2012

5. Emerging challenges and materials for thermal management of electronics

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