1. Overview of 3D NAND Flash and progress of split-page 3D vertical gate (3DVG) NAND architecture
2. Jang, J. Vertical Cell Array using TCAT (Terabit Cell Array Transistor) Technology for Ultra High Density NAND Flash Memory. Symposium on VLSI Technology Digest; IEEE: Piscataway, NJ, 2009; pp 192–193.
3. Feasibility of InxGa1–xAs High Mobility Channel for 3-D NAND Memory
4. Choi, B.; Jang, S. H.; Yoon, J.; Lee, J.; Jeon, M.; Lee, Y.; Han, J.; Lee, J.; Kim, M.; Kim, D. H.; Lim, C.; Park, S.; Choi, S.J. Comprehensive Evaluation of Early Retention (Fast Charge Loss Within a Few Seconds) Characteristics in Tube-Type 3-D NAND Flash Memory. In Proceedings of IEEE Symposium on VLSI Technology; IEEE: Piscataway, NJ, 2016; pp 1–2.
5. Device Characteristics of Single-Gate Vertical Channel (SGVC) 3D NAND Flash Architecture