Study on Room-Temperature Wet Oxidation of Silicon Catalyzed by Copper-Reference-Cited by-同舟云学术

Study on Room-Temperature Wet Oxidation of Silicon Catalyzed by Copper

Published:2023-01-03 Issue:2 Volume:39 Page:750-755
ISSN:0743-7463
Container-title:Langmuir
language:en
Short-container-title:Langmuir

Author:

Liu Xianhui¹,Jia Lele¹,Zou Tongqing¹,Cai Chengjie¹,Liang Bohao¹,Xiong Jinxin¹,Chao Jie¹^ORCID,Feng Biao²,Yang Lijun²^ORCID,Li Shaozhou¹^ORCID

Affiliation:

1. State Key Laboratory of Organic Electronics and Information Displays & Institute of Advanced Materials, Nanjing University of Posts & Telecommunications, Nanjing, Jiangsu210023, People’s Republic of China

2. Key Laboratory of Mesoscopic Chemistry of MOE and Jiangsu Provincial Lab for Nanotechnology, School of Chemistry and Chemical Engineering, Nanjing University, Nanjing, Jiangsu210023, People’s Republic of China

Publisher

American Chemical Society (ACS)

Subject

Electrochemistry,Spectroscopy,Surfaces and Interfaces,Condensed Matter Physics,General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.langmuir.2c02467

Reference32 articles.

1. Copper metallization of electrodes for silicon heterojunction solar cells: Process, reliability and challenges

2. Reliability challenges for copper interconnects

3. The Impact of Back-Side Cu Contamination on 3D Stacking Architecture

4. On copper diffusion in silicon measured by glow discharge mass spectrometry

5. Microstructure evolution and mechanical behavior of copper through‑silicon via structure under thermal cyclic loading

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