Photo-and Heat-Induced Dismantlable Adhesion Interfaces Prepared by Layer-by-Layer Deposition-Reference-Cited by-同舟云学术

Photo-and Heat-Induced Dismantlable Adhesion Interfaces Prepared by Layer-by-Layer Deposition

Published:2023-02-07 Issue:7 Volume:39 Page:2771-2778
ISSN:0743-7463
Container-title:Langmuir
language:en
Short-container-title:Langmuir

Author:

Aizawa Miho¹²³⁴^ORCID,Akiyama Haruhisa⁵,Yamamoto Takahiro¹^ORCID,Matsuzawa Yoko¹

Affiliation:

1. Research Institute for Sustainable Chemistry, National Institute of Advanced Industrial Science and Technology, Central 5, 1-1-1 Higashi, Tsukuba, Ibaraki 305-8565, Japan

2. Laboratory for Chemistry and Life Science, Institute of Innovative Research, Tokyo Institute of Technology, R1-12, 4259 Nagatsuta, Midori-ku, Yokohama 226-8503, Japan

3. Department of Chemical Science and Engineering, Tokyo Institute of Technology, 2-12-1 Ookayama, Meguro-ku, Tokyo 152-8552, Japan

4. PRESTO, JST, 4-1-8 Honcho, Kawaguchi 332-0012, Japan

5. Nanomaterials Research Institute, National Institute of Advanced Industrial Science and Technology, Central 5, 1-1-1 Higashi, Tsukuba, Ibaraki 305-8565, Japan

Funder

Ministry of Education, Culture, Sports, Science and Technology

Publisher

American Chemical Society (ACS)

Subject

Electrochemistry,Spectroscopy,Surfaces and Interfaces,Condensed Matter Physics,General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.langmuir.2c03233

Reference45 articles.

1. Testing mechanical performance of adhesively bonded composite joints in engineering applications: an overview

2. Review on Adhesives and Surface Treatments for Structural Applications: Recent Developments on Sustainability and Implementation for Metal and Composite Substrates

3. Supramolecular polymer adhesives: advanced materials inspired by nature

4. Overview of disbonding technologies for adhesive bonded joints

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