Theoretical Study on the Adhesion Interaction between Epoxy Resin Including Curing Agent and Plated Gold Surface
Author:
Affiliation:
1. Institute for Materials Chemistry and Engineering and IRCCS, Kyushu University, 744 Motooka, Nishi-ku, Fukuoka 819-0395, Japan
2. Research and Development Center, ROHM Co., Ltd., 21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan
Funder
Core Research for Evolutional Science and Technology
Japan Society for the Promotion of Science
Publisher
American Chemical Society (ACS)
Subject
Electrochemistry,Spectroscopy,Surfaces and Interfaces,Condensed Matter Physics,General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acs.langmuir.1c00285
Reference80 articles.
1. The science of adhesion
2. An overview of the basic aspects of polymer adhesion. Part II: Application to surface treatments
3. A Study of Adhesion Interface about Die Bonding Structure with Conductive Silver Paste
4. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
5. An experimental study of sidewall adhesion in microelectromechanical systems
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