A Vapor-Phase Deposited Polymer Film to Improve the Adhesion of Electroless-Deposited Copper Layer onto Various Kinds of Substrates-Reference-Cited by-同舟云学术

A Vapor-Phase Deposited Polymer Film to Improve the Adhesion of Electroless-Deposited Copper Layer onto Various Kinds of Substrates

Published:2014-01-14 Issue:3 Volume:30 Page:916-921
ISSN:0743-7463
Container-title:Langmuir
language:en
Short-container-title:Langmuir

Author:

You Jae Bem¹,Kim Shin Young¹,Park Yong Jin²,Ko Young Gwan²,Im Sung Gap¹

Affiliation:

1. Department of Chemical and Biomolecular Engineering and KI for the NanoCentury, Korea Advanced Institute of Science and Technology (KAIST), 305-701 Daejeon, Republic of Korea

2. ACI Development Team, ACI Division, Samsung Electro-Mechanics Co., Ltd. (SEMCO), 443-743 Suwon, Republic of Korea

Publisher

American Chemical Society (ACS)

Subject

Electrochemistry,Spectroscopy,Surfaces and Interfaces,Condensed Matter Physics,General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/la404251h

Reference44 articles.

1. An experimental method for the determination of metal–polymer adhesion

2. Surface modification of polyimide film by coupling reaction for copper metallization

3. Evaluation of mechanical interlock effect on adhesion strength of polymer–metal interfaces using micro-patterned surface topography

4. Prediction of Losses Caused by Roughness of Metallization in Printed-Circuit Boards

5. Rapid plasma treatment of polyimide for improved adhesive and durable copper film deposition

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