Surface modification of polyimide film by coupling reaction for copper metallization-Reference-Cited by-同舟云学术

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Surface modification of polyimide film by coupling reaction for copper metallization

Published:2009-01 Issue:1 Volume:15 Page:23-30
ISSN:1226-086X
Container-title:Journal of Industrial and Engineering Chemistry
language:en
Short-container-title:Journal of Industrial and Engineering Chemistry

Author:

Kim Hwa Jin,Park Yun Jun,Choi Jong-Ho,Han Hak Soo,Hong Young Taik

Publisher

Elsevier BV

Subject

General Chemical Engineering

Reference22 articles.

1. Polyimides: Fundamentals and Applications;Lee,1996

2. Polyimides

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