Super-high interface adhesion through silver/polyimide heterojunction
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference44 articles.
1. Improvements of mechanical fatigue reliability of cu interconnects on flexible substrates through MoTi alloy under-layer;Lee;Electronic Materials Letters,2015
2. Assembly of surface-mounted devices on flexible substrates by isotropic conductive adhesive and solder and lifetime characterization;Saleh;Micromachines,2022
3. Significant reduction of interfacial thermal resistance and phonon scattering in graphene/polyimide thermally conductive composite films for thermal management;Ruan;Research,2021
4. A patternable and in situ formed polymeric zinc blanket for a reversible zinc anode in a skin-mountable microbattery;Zhu;Advanced Materials,2021
5. Stable, amphiphobic, and electrically conductive coating on flexible polyimide substrate;Jeon;Journal of Industrial and Engineering Chemistry,2023
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