Effect of 0.5 wt % Cu in Sn−3.5%Ag Solder on the Interfacial Reaction with Au/Ni Metallization
Author:
Affiliation:
1. Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong
2. Department of Materials Science and Engineering, UCLA, Los Angeles, California 90095-1595
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,General Chemical Engineering,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/cm034692c
Reference23 articles.
1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
2. Lead-free Solders in Microelectronics
3. Interfacial reaction of Pb-Sn solder and Sn-Ag solder with electroless Ni deposit during reflow
4. Advances in lead-free electronics soldering
5. Ripening‐assisted asymmetric spalling of Cu‐Sn compound spheroids in solder joints on Si wafers
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