Effect of Current Density on the Nucleation and Growth of Crystal Facets during Pulse Electrodeposition of Sn–Cu Lead-Free Solder
Author:
Affiliation:
1. Department of Metallurgical and Materials Engineering, Indian Institute of Technology Kharagpur, Kharagpur, 721302, India
Publisher
American Chemical Society (ACS)
Subject
Condensed Matter Physics,General Materials Science,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/cg501440a
Reference31 articles.
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4. Low-cost wafer bumping
5. Grain Growth in Thin Films
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