Effect of Current Density on the Nucleation and Growth of Crystal Facets during Pulse Electrodeposition of Sn–Cu Lead-Free Solder-Reference-Cited by-同舟云学术

Effect of Current Density on the Nucleation and Growth of Crystal Facets during Pulse Electrodeposition of Sn–Cu Lead-Free Solder

Published:2014-11-17 Issue:12 Volume:14 Page:6542-6549
ISSN:1528-7483
Container-title:Crystal Growth & Design
language:en
Short-container-title:Crystal Growth & Design

Author:

Mallik Manila¹,Mitra Arijit¹,Sengupta Srijan¹,Das Karabi¹,Ghosh Rabindra N.¹,Das Siddhartha¹

Affiliation:

1. Department of Metallurgical and Materials Engineering, Indian Institute of Technology Kharagpur, Kharagpur, 721302, India

Publisher

American Chemical Society (ACS)

Subject

Condensed Matter Physics,General Materials Science,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/cg501440a

Reference31 articles.

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4. Low-cost wafer bumping

5. Grain Growth in Thin Films

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