Cellular Automata Model of Phase Transition in Binary Mixtures-Reference-Cited by-同舟云学术

Cellular Automata Model of Phase Transition in Binary Mixtures

Published:2006-03-17 Issue:8 Volume:45 Page:2892-2896
ISSN:0888-5885
Container-title:Industrial & Engineering Chemistry Research
language:en
Short-container-title:Ind. Eng. Chem. Res.

Author:

Vannozzi Carolina¹,Fiorentino Diego¹,D'Amore Matteo¹,Rumshitzki David S.¹,Dress Andreas¹,Mauri Roberto¹

Affiliation:

1. Department of Chemical Engineering, University of Pisa, 56126 Pisa, Italy, Department of Chemical and Food Engineering, University of Salerno, Italy, Department of Chemical Engineering, City College of CUNY, New York, New York 10031, and Institute for Computational Biology, Shanghai Institute for Biological Sciences, Shanghai, People's Republic of China

Publisher

American Chemical Society (ACS)

Subject

Industrial and Manufacturing Engineering,General Chemical Engineering,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/ie051240w

Reference23 articles.

1. Theory of dynamic critical phenomena

2. The thermodynamic theory of capillarity under the hypothesis of a continuous variation of density

3. Free Energy of a Nonuniform System. III. Nucleation in a Two‐Component Incompressible Fluid

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Stochastic formulation of multiwave pandemic: decomposition of growth into inherent susceptibility and external infectivity distributions;Journal of Chemical Sciences;2021-11-18

2. Persistence of a pandemic in the presence of susceptibility and infectivity distributions in a population: Mathematical model;2021-01-08

3. Mathematical modeling and cellular automata simulation of infectious disease dynamics: Applications to the understanding of herd immunity;The Journal of Chemical Physics;2020-09-21

4. Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient;Microelectronics Reliability;2019-01

5. Review and outlook: mechanical, thermodynamic, and kinetic continuum modeling of metallic materials at the grain scale;MRS Communications;2017-12