Thermal Stability of Copper–Nickel and Copper–Nickel Silicide Contacts for Crystalline Silicon-Reference-Cited by-同舟云学术

Thermal Stability of Copper–Nickel and Copper–Nickel Silicide Contacts for Crystalline Silicon

Published:2018-05-17 Issue:6 Volume:1 Page:2841-2848
ISSN:2574-0962
Container-title:ACS Applied Energy Materials
language:en
Short-container-title:ACS Appl. Energy Mater.

Author:

Kale Abhijit S.¹^ORCID,Nemeth William²,Perkins Craig L.²^ORCID,Young David²,Marshall Alexander³,Florent Karine³,Kurinec Santosh K.³,Stradins Paul²,Agarwal Sumit¹

Affiliation:

1. Chemical and Biological Engineering Department, Colorado School of Mines, 1613 Illinois Street, Golden, Colorado 80401, United States

2. National Energy Renewable Laboratory, 15013 Denver West Parkway, Golden, Colorado 80401, United States

3. Electrical and Microelectronic Engineering, Rochester Institute of Technology, 1 Lomb Memorial Drive, Rochester, New York 14623, United States

Funder

National Renewable Energy Laboratory

Solar Energy Technologies Program

Publisher

American Chemical Society (ACS)

Subject

Electrical and Electronic Engineering,Materials Chemistry,Electrochemistry,Energy Engineering and Power Technology,Chemical Engineering (miscellaneous)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsaem.8b00488

Reference34 articles.

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3. Effect of glass frit chemistry on the physical and electrical properties of thick-film Ag contacts for silicon solar cells

4. Physical understanding of printed thick-film front contacts of crystalline Si solar cells—Review of existing models and recent developments

5. Impact of screen printing silver paste components on the space charge region recombination losses of industrial silicon solar cells

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