Comparison of CH, C3, CHF, and CF2 Surface Reactivities during Plasma-Enhanced Chemical Vapor Deposition of Fluorocarbon Films
Author:
Affiliation:
1. Department of Chemistry, Colorado State University, Fort Collins, Colorado 80523-1872
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/am900034x
Reference54 articles.
1. Properties of Thin Polyimide Films
2. Characterization of porosity and dielectric constant of fluorocarbon porous films synthesized by using plasma-enhanced chemical vapor deposition and solvent process
3. Comparison of Pulsed and Continuous-Wave Deposition of Thin Films from Saturated Fluorocarbon/H2 Inductively Coupled rf Plasmas
4. Ion and substrate effects on surface reactions of CF2 using C2F6, C2F6/H2, and hexafluoropropylene oxide plasmas
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