Copper Layers Deposited on Aluminum by Galvanic Displacement
Author:
Affiliation:
1. Department of Chemical and Biological Engineering, Iowa State University, Ames, Iowa 50011, United States
2. US DOE, Ames Laboratory, Ames, Iowa 50011, United States
Publisher
American Chemical Society (ACS)
Subject
Surfaces, Coatings and Films,Physical and Theoretical Chemistry,General Energy,Electronic, Optical and Magnetic Materials
Link
https://pubs.acs.org/doi/pdf/10.1021/jp2054266
Reference31 articles.
1. Electrochemical Deposition of Copper on n‐Si/TiN
2. Direct Copper Electrodeposition on TaN Barrier Layers
3. Influence of Oxide Thickness on Nucleation and Growth of Copper on Tantalum
4. Nucleation Characteristics of Directly Electrodeposited Copper on TiN
5. Selective and Blanket Electroless Copper Deposition for Ultralarge Scale Integration
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