Symmetrical “Sandwich” Polybutadiene Film with High-Frequency Low Dielectric Constants, Ultralow Dielectric Loss, and High Adhesive Strength
Author:
Affiliation:
1. The State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Chengdu 610065, China
Funder
National Natural Science Foundation of China
Publisher
American Chemical Society (ACS)
Subject
Industrial and Manufacturing Engineering,General Chemical Engineering,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/acs.iecr.9b05676
Reference24 articles.
1. Tasaki, T.; Shiotani, A.; Tsuji, M.; Nakamura, T.; Yamaguchi, T. The low Dk/Df adhesives for high frequency printed circuit board using the novel solvent soluble polyimide. 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT); IEEE: 2015, 221.
2. Latest advancement of fully additive process for 8 µm ultra-fine pitch chip-on-film (COF) by nano-size Ni–P metallization
3. Review of polymer materials with low dielectric constant
4. Overview on Low Dielectric Constant Materials for IC Applications
5. Evaluation of a PECVD advanced barrier (k=3.7) for 32nm CMOS technology and below
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