Curing kinetics study of thermosetting resin material with ultra-low dielectric loss for advanced electronic packaging-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Curing kinetics study of thermosetting resin material with ultra-low dielectric loss for advanced electronic packaging

Published:2024-01 Issue: Volume:130 Page:108312
ISSN:0142-9418
Container-title:Polymer Testing
language:en
Short-container-title:Polymer Testing

Author:

Fang Zeming,Wu Xiaowei,Zhu Xiaotao^ORCID,Luo Cheng,Li Dan,Liu Qianfa,Wang Ke^ORCID

Funder

Department of Science and Technology of Guangdong Province

Science, Technology and Innovation Commission of Shenzhen Municipality

Science and Technology Department of Guangxi Zhuang Autonomous Region

Publisher

Elsevier BV

Subject

Polymers and Plastics,Organic Chemistry

Reference49 articles.

1. Facile preparation of recyclable cyclic polyolefin/polystyrene vitrimers with low dielectric loss based on semi-interpenetrating polymer networks for high-frequency copper-clad laminates;Wang;Polymer,2021

2. Enhanced thermal conductivity of benzoxazine nanocomposites based on non-covalent functionalized hexagonal boron nitride;Chen;Compos. Sci. Technol.,2019

3. Characterization of ABF/Glass/ABF substrates for mmWave applications;Ur Rehman;IEEE Trans. Compon. Packag. Manuf. Technol.,2021

4. Preparation of low-k poly(dicyclopentadiene) nanocomposites with excellent comprehensive properties by adding larger POSS;Wang;Chem. Eng. J.,2022

5. Using Dicyclopentadiene-derived polyarylates as epoxy curing agents to achieve high Tg and low dielectric epoxy thermosets;Lin;ACS Omega,2018

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Predictive modeling of dielectric properties in crosslinked polyphenylene oxide systems: Molecular dynamics simulations and experimental validation;Polymer Engineering & Science;2024-07-25

2. Fundamentals of Infrared Heating and Their Application in Thermosetting Polymer Curing: A Review;Coatings;2024-07-12

3. Optimizing biobased thermoset resins by incorporating cinnamon derivative into acrylated epoxidized soybean oil;Materials & Design;2024-07

4. Application of Multi-Vinyl Silicon-Containing Cross-Linkers in Free-Radical Cross-Linked Thermosets with Ultra-Low Dielectric Loss;Industrial & Engineering Chemistry Research;2024-06-20

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3