Characterizing Local Electronic States of Twin Boundaries in Copper-Reference-Cited by-同舟云学术

Characterizing Local Electronic States of Twin Boundaries in Copper

Published:2024-04-23 Issue:18 Volume:24 Page:5474-5480
ISSN:1530-6984
Container-title:Nano Letters
language:en
Short-container-title:Nano Lett.

Author:

Ni Jiamiao¹,Cao Lin²,Zhong Boan¹,Li Quan¹,Guo Chongxiao¹,Song Jian¹,Liu Yue¹^ORCID,Lu Minghui²,Fan Tongxiang¹^ORCID

Affiliation:

1. State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, People’s Republic of China

2. National Laboratory of Solid-State Microstructures and Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, People’s Republic of China

Funder

Science and Technology Commission of Shanghai Municipality

National Natural Science Foundation of China

Fundamental Research Special Zone Program of Shanghai Jiao Tong University

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.nanolett.4c00550

Reference54 articles.

1. Observation of Atomic Diffusion at Twin-Modified Grain Boundaries in Copper

2. Improved Cu/Sn interface reliability using double-layer stacked nano-twinned Cu

3. Plasticity and ultra-low stress induced twin boundary migration in nanotwinned Cu by in situ nanoindentation studies

4. Migration kinetics of twinning disconnections in nanotwinned Cu: An in situ HRTEM deformation study

5. Incoherent twin boundary migration induced by ion irradiation in Cu

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