Migration kinetics of twinning disconnections in nanotwinned Cu: An in situ HRTEM deformation study-Reference-Cited by-同舟云学术

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Migration kinetics of twinning disconnections in nanotwinned Cu: An in situ HRTEM deformation study

Published:2021-03 Issue: Volume:194 Page:113621
ISSN:1359-6462
Container-title:Scripta Materialia
language:en
Short-container-title:Scripta Materialia

Author:

Li Q.,Song J.,Liu G.S.,Liu Y.,Wang J.,Zeng X.Q.

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering

Reference32 articles.

1. Ultrahigh Strength and High Electrical Conductivity in Copper

2. Nano-sized twins induce high rate sensitivity of flow stress in pure copper

3. Tensile properties of copper with nano-scale twins

4. Deformation twinning in nanocrystalline materials

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1. Disconnection units of twinning in body-centered-cubic metals;Acta Materialia;2024-11

2. Characterizing Local Electronic States of Twin Boundaries in Copper;Nano Letters;2024-04-23

3. Strengthening mechanisms in heterostructured copper films with highly (220)-oriented vertical nanotwins;Acta Mechanica Sinica;2024-01

4. Tuning Intermediates Adsorption and C─N Coupling for Efficient Urea Electrosynthesis Via Doping Ni into Cu;Small Methods;2023-11-23

5. Atomic study on the deformation behavior of nanotwinned CoCrCuFeNi high entropy alloy during nanoscratching;Journal of Materials Research and Technology;2023-07

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