Dimension Engineering of High-Quality InAs Nanostructures on a Wafer Scale

Author:

Pan Dong12,Wang Ji-Yin3,Zhang Wei45,Zhu Lujun67,Su Xiaojun4,Fan Furong3,Fu Yuhao8,Huang Shaoyun3,Wei Dahai1,Zhang Lijun8ORCID,Sui Manling6,Yartsev Arkady4ORCID,Xu Hongqi3910ORCID,Zhao Jianhua121011ORCID

Affiliation:

1. State Key Laboratory of Superlattices and Microstructures, Institute of Semiconductors, Chinese Academy of Sciences, P.O. Box 912, Beijing 100083, China

2. Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100190, China

3. Beijing Key Laboratory of Quantum Devices, Key Laboratory for the Physics and Chemistry of Nanodevices and Department of Electronics, Peking University, Beijing 100871, China

4. NanoLund and Division of Chemical Physics, Lund University, Box 124, 22100 Lund, Sweden

5. School of Physics and Electronic Engineering, Guangzhou University, Guangzhou 510006, China

6. Institute of Microstructure and Properties of Advanced Materials, Beijing University of Technology, Beijing 100124, China

7. College of Physics and Information Technology, Shaanxi Normal University, Xi’an 710062, China

8. Key Laboratory of Automobile Materials of MOE and School of Materials Science and Engineering, Jilin University, Changchun 130012, China

9. NanoLund and Division of Solid-State Physics, Lund University, Box 118, S-22100 Lund, Sweden

10. Beijing Academy of Quantum Information Sciences, Beijing 100193, China

11. CAS Center for Excellence in Topological Quantum Computation, University of Chinese Academy of Sciences, Beijing 100190, China

Funder

National Natural Science Foundation of China

Ministry of Science and Technology of the People's Republic of China

Natural Science Foundation of Beijing Municipality

Youth Innovation Promotion Association of the Chinese Academy of Sciences

Publisher

American Chemical Society (ACS)

Subject

Mechanical Engineering,Condensed Matter Physics,General Materials Science,General Chemistry,Bioengineering

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