High Throughput Nanoimaging of Thermal Conductivity and Interfacial Thermal Conductance-Reference-Cited by-同舟云学术

High Throughput Nanoimaging of Thermal Conductivity and Interfacial Thermal Conductance

Published:2022-05-17 Issue:11 Volume:22 Page:4325-4332
ISSN:1530-6984
Container-title:Nano Letters
language:en
Short-container-title:Nano Lett.

Author:

Wang Mingkang¹²,Ramer Georg²³⁴^ORCID,Perez-Morelo Diego J.¹²,Pavlidis Georges³⁵,Schwartz Jeffrey J.²³,Yu Liya¹,Ilic Robert¹,Aksyuk Vladimir A.¹^ORCID,Centrone Andrea³^ORCID

Affiliation:

1. Microsystems and Nanotechnology Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, United States

2. Institute for Research in Electronics and Applied Physics, University of Maryland, College Park, Maryland 20742, United States

3. Nanoscale Devices Characterization Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, United States

4. Institute of Chemical Technologies and Analytics, TU Wien, Getreidemarkt 9, 1060 Vienna, Austria

5. Department of Mechanical Engineering, University of Connecticut, Storrs, Connecticut 06269, United States

Funder

Center for Nanoscale Science and Technology

Publisher

American Chemical Society (ACS)

Subject

Mechanical Engineering,Condensed Matter Physics,General Materials Science,General Chemistry,Bioengineering

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.nanolett.2c00337

Reference62 articles.

1. Radiative heat transfer at the nanoscale

2. Superior Thermal Conductivity of Single-Layer Graphene

3. Polycrystalline SnSe with a thermoelectric figure of merit greater than the single crystal

4. Nanostructured Thermoelectrics: Big Efficiency Gains from Small Features

5. Spontaneous current constriction in threshold switching devices

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