Solvent-Mediated Modulation of the Au–S Bond in Dithiol Molecular Junctions
Author:
Affiliation:
1. Department of Chemistry, Columbia University, 3000 Broadway, New York, New York 10027, United States
2. Department of Applied Physics, Columbia University, 500 West 120th Street, New York, New York 10027, United States
Funder
Division of Chemistry
United States-Israel Binational Science Foundation
Division of Materials Research
CCI Phase I: Center for Chemistry with Electric Fields
Publisher
American Chemical Society (ACS)
Subject
Mechanical Engineering,Condensed Matter Physics,General Materials Science,General Chemistry,Bioengineering
Link
https://pubs.acs.org/doi/pdf/10.1021/acs.nanolett.3c04058
Reference40 articles.
1. The gold–sulfur interface at the nanoscale
2. Synthesis, Structure, and Properties of Model Organic Surfaces
3. Single Molecule Junctions Formed via Au−Thiol Contact: Stability and Breakdown Mechanism
4. Molecular Tunnel Junctions Based on π-Conjugated Oligoacene Thiols and Dithiols between Ag, Au, and Pt Contacts: Effect of Surface Linking Group and Metal Work Function
5. Stretching of BDT-gold molecular junctions: thiol or thiolate termination?
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