Single Molecule Junctions Formed via Au−Thiol Contact: Stability and Breakdown Mechanism-Reference-Cited by-同舟云学术

Single Molecule Junctions Formed via Au−Thiol Contact: Stability and Breakdown Mechanism

Published:2007-10-01 Issue:43 Volume:129 Page:13225-13231
ISSN:0002-7863
Container-title:Journal of the American Chemical Society
language:en
Short-container-title:J. Am. Chem. Soc.

Author:

Huang ¹,Chen Fang¹,Bennett Peter A.¹,Tao ¹

Affiliation:

1. Contribution from the Department of Electrical Engineering and The Center for Solid State Electronics Research, and Department of Physics, Arizona State University, Tempe, Arizona 85287

Publisher

American Chemical Society (ACS)

Subject

Colloid and Surface Chemistry,Biochemistry,General Chemistry,Catalysis

Link

https://pubs.acs.org/doi/pdf/10.1021/ja074456t

Reference46 articles.

1. Contact Resistance in Metal−Molecule−Metal Junctions Based on Aliphatic SAMs: Effects of Surface Linker and Metal Work Function

2. Single-Molecule Circuits with Well-Defined Molecular Conductance

3. Carbon/molecule/metal molecular electronic junctions: the importance of “contacts”

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