Remote Epitaxy: Fundamentals, Challenges, and Opportunities-Reference-Cited by-同舟云学术

Remote Epitaxy: Fundamentals, Challenges, and Opportunities

Published:2024-03-04 Issue:10 Volume:24 Page:2939-2952
ISSN:1530-6984
Container-title:Nano Letters
language:en
Short-container-title:Nano Lett.

Author:

Park Bo-In¹²^ORCID,Kim Jekyung¹²,Lu Kuangye¹²^ORCID,Zhang Xinyuan²³,Lee Sangho¹²^ORCID,Suh Jun Min¹²,Kim Dong-Hwan⁴⁵^ORCID,Kim Hyunseok⁶⁷^ORCID,Kim Jeehwan¹²³⁸^ORCID

Affiliation:

1. Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States

2. Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States

3. Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States

4. School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea

5. Biomedical Institute for Convergence at SKKU (BICS), Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea

6. Department of Electrical and Computer Engineering, University of Illinois Urbana−Champaign, Urbana, Illinois 61801, United States

7. Nick Holonyak, Jr. Micro and Nanotechnology Laboratory, University of Illinois Urbana−Champaign, Urbana, Illinois 61801, United States

8. Microsystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States

Funder

Korea Health Industry Development Institute

U.S. Department of Defense

National Research Foundation of Korea

Korea Institute for Advancement of Technology

National Science Foundation

U.S. Department of Energy

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.nanolett.3c04465

Reference63 articles.

1. International Roadmap for Devices and Systems 2022 Edition. https://irds.ieee.org/editions/2022 (accessed 2024-02-07).

2. An overview of through-silicon-via technology and manufacturing challenges

3. Remote epitaxy through graphene enables two-dimensional material-based layer transfer

4. High-throughput manufacturing of epitaxial membranes from a single wafer by 2D materials-based layer transfer process

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