Copper Dissolution in Aqueous Ammonia-Containing Media during Chemical Mechanical Polishing
Author:
Affiliation:
1. Department of Chemical Engineering and Center for Advanced Materials Processing, Clarkson University, Potsdam, New York 13699
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,General Chemical Engineering,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/cm970168s
Reference21 articles.
1. Copper interconnection integration and reliability
2. Contact and via structures with copper interconnects fabricated using dual Damascene technology
3. Stabilization of Alumina Slurry for Chemical−Mechanical Polishing of Copper
4. Chemical mechanical polishing of copper for multilevel metallization
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