Engineering the Interface of Cu-hBN Immiscible System Using 3D Printing To Enhance Mechanical and Thermal Properties-Reference-Cited by-同舟云学术

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Engineering the Interface of Cu-hBN Immiscible System Using 3D Printing To Enhance Mechanical and Thermal Properties

Published:2024-04-01 Issue:5 Volume:2 Page:1234-1244
ISSN:2771-9545
Container-title:ACS Applied Engineering Materials
language:en
Short-container-title:ACS Appl. Eng. Mater.

Author:

Das Rakesh¹,Katiyar Nirmal Kumar¹²^ORCID,Sarkar Suman³,Sarkar Suman³,Mishra Vidhyadhar³,Tiwary Chandra Sekhar¹^ORCID

Affiliation:

1. Department of Metallurgical and Materials Engineering, Indian Institute of Technology Kharagpur, Kharagpur,West Bengal 721302, India

2. Amity Institute of Applied Sciences, Amity University Noida, Sector 125, Noida, Uttar Pradesh 201303, India

3. Department of Materials Engineering, Indian Institute of Technology Jammu, Jammu, Jammu & Kashmir 181221, India

Funder

Department of Science and Technology, Ministry of Science and Technology, India

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsaenm.3c00722

Reference40 articles.

1. A defect-resistant Co–Ni superalloy for 3D printing

2. Metal Matrix Composites

3. Direct Ink Writing of Poly(tetrafluoroethylene) (PTFE) with Tunable Mechanical Properties

4. Three-dimensional Printing of Silver Microarchitectures Using Newtonian Nanoparticle Inks

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Tensile properties and damage mechanisms of 3D printed Ti-24Nb-4Zr-8Sn alloy and polyurea interpenetrating phase composites;Journal of Alloys and Compounds;2024-12

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