High-Energy Electron-Irradiated Fluorinated Ethylene Polypropylene Copolymer Coatings on Al Substrates for Enhanced Metal Adhesion and Protection
Author:
Affiliation:
1. Analysis Technology Research Center, Sumitomo Electric Industries, Ltd., 1-1-3 Shimaya, Konohana-ku, Osaka-shi, Osaka 554-0024, Japan
Funder
Ministry of Education, Culture, Sports, Science and Technology
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acsanm.2c00766
Reference61 articles.
1. Metallization of polymer composites by metalorganic chemical vapor deposition of Cu: Surface functionalization driven films characteristics
2. Controlled Formation of Surface Patterns in Metal Films Deposited on Elasticity-Gradient PDMS Substrates
3. Thin Film Adhesion of Flexible Electronics Influenced by Interlayers
4. Interfacial mutations in the Al-polyimide system
5. Fabrication of a Bilayer Structure of Cu and Polyimide To Realize Circuit Microminiaturization and High Interfacial Adhesion in Flexible Electronic Devices
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