One-Step Fabrication of Copper Nanopillar Array-Filled AAO Films by Pulse Electrodeposition for Anisotropic Thermal Conductive Interconnectors
Author:
Affiliation:
1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
Funder
Program for New Century Excellent Talents in University
National Natural Science Foundation of China
Publisher
American Chemical Society (ACS)
Subject
General Chemical Engineering,General Chemistry
Link
http://pubs.acs.org/doi/pdf/10.1021/acsomega.8b03533
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