Role of Cu2+ as an Additive in an Electroless Nickel−Phosphorus Plating System: A Stabilizer or a Codeposit?-Reference-Cited by-同舟云学术

Role of Cu2+ as an Additive in an Electroless Nickel−Phosphorus Plating System: A Stabilizer or a Codeposit?

Published:2006-06-01 Issue:13 Volume:18 Page:2959-2968
ISSN:0897-4756
Container-title:Chemistry of Materials
language:en
Short-container-title:Chem. Mater.

Author:

Chen Chun-Han¹,Chen Bing-Hung¹,Hong L.¹

Affiliation:

1. Department of Chemical Engineering and Center for Micro/Nano Science and Technology, National Cheng Kung University, 1 University Road, Tainan 70101, Taiwan, and Department of Chemical and Biomolecular Engineering, National University of Singapore, 4 Engineering Drive 4, Singapore 117576

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,General Chemical Engineering,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/cm0527571

Reference24 articles.

1. Electroless Deposition of Ni-Cu-P Alloys in Acidic Solutions

2. Interface between electroless amorphous Ni–Cu–P coatings and Al substrate

3. Role of a Pb2+ Stabilizer in the Electroless Nickel Plating System: A Theoretical Exploration

4. Fabrication of magnetic mesostructured nickel–cobalt alloys from lyotropic liquid crystalline media by electroless deposition

Cited by 44 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Study on the Dependence between Surface Topography and Icephobic Behavior of Ni–Cu–P Ternary Coatings;Advanced Engineering Materials;2024-01-10

2. Electroless Metallization of the Elements: Survey and Progress;ACS Applied Electronic Materials;2022-12-07

3. Study on the influencing factors of spontaneous wettability transition behaviour on metallic-based surfaces;Vacuum;2022-06

4. Inorganic salts stabilizers effect in electroless nickel-boron plating: Stabilization mechanism and microstructure modification;Surface and Coatings Technology;2020-11

5. Triethanolamine-mediated photodeposition formation of amorphous Ni-P alloy for improved H2-evolution activity of g-C3N4;Science China Materials;2020-04-09