Role of a Pb2+ Stabilizer in the Electroless Nickel Plating System: A Theoretical Exploration-Reference-Cited by-同舟云学术

Role of a Pb2+ Stabilizer in the Electroless Nickel Plating System: A Theoretical Exploration

Published:2004-06-29 Issue:30 Volume:108 Page:10919-10929
ISSN:1520-6106
Container-title:The Journal of Physical Chemistry B
language:en
Short-container-title:J. Phys. Chem. B

Author:

Yin X.¹,Hong L.¹,Chen B-H.¹

Affiliation:

1. Department of Chemical and Biomolecular Engineering, National University of Singapore, 10 Kent Ridge Crescent, Singapore 119260, and Department of Chemical Engineering, National Cheng Kung University, 1 University Road, Tainan 70101, Taiwan

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,Surfaces, Coatings and Films,Physical and Theoretical Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/jp036070k

Reference46 articles.

1. Nickel plating on steel by chemical reduction

2. Selective Electroless Metal Deposition for Via Hole Filling in VLSI Multilevel Interconnection Structures

3. Selective Electroless Ni‐Cu(P) Deposition for Via Hole Filling and Conductor Pattern Cladding in VLSI Multilevel Interconnection Structures

4. The interaction kinetics and compound formation between electroless NiP and solder

5. Interconnect resistance characteristics of several flip-chip bumping and assembly techniques

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