Vertical III–V Nanowire Device Integration on Si(100)

Author:

Borg Mattias1,Schmid Heinz1,Moselund Kirsten E.1,Signorello Giorgio1,Gignac Lynne2,Bruley John2,Breslin Chris2,Das Kanungo Pratyush1,Werner Peter3,Riel Heike1

Affiliation:

1. IBM Research-Zurich, Säumerstrasse 4, 8803, Rüschlikon, Switzerland

2. IBM Thomas J. Watson Research Center, 1101 Kitchawan Road, Yorktown Heights, New York 10598, United States

3. Max Planck Institute of Microstructure Physics, Weinberg 2, 06120 Halle, Germany

Publisher

American Chemical Society (ACS)

Subject

Mechanical Engineering,Condensed Matter Physics,General Materials Science,General Chemistry,Bioengineering

Reference48 articles.

1. Wafer-scale integration of group III–V lasers on silicon using transfer printing of epitaxial layers

2. Nanometre-scale electronics with III–V compound semiconductors

3. 30-nm InAs Pseudomorphic HEMTs on an InP Substrate With a Current-Gain Cutoff Frequency of 628 GHz

4. Egard, M.; Ohlsson, L.; Borg, B. M.; Lenrick, F.; Wallenberg, R.; Wernersson, L.E.; Lind, E.InElectron Devices Meeting (IEDM), 2011:IEEE International:Washington, DC, 2011; pp13.2.1–13.2.4.

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