A Molecular Simulation Approach to Bond Reorganization in Epoxy Resins: From Curing to Deformation and Fracture-Reference-Cited by-同舟云学术

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A Molecular Simulation Approach to Bond Reorganization in Epoxy Resins: From Curing to Deformation and Fracture

Published:2021-08-27 Issue:3 Volume:1 Page:165-174
ISSN:2694-2453
Container-title:ACS Polymers Au
language:en
Short-container-title:ACS Polym. Au

Author:

Konrad Julian¹,Meißner Robert H.²³^ORCID,Bitzek Erik⁴,Zahn Dirk⁵^ORCID

Affiliation:

1. Department of Chemistry and Pharmacy, Computer Chemistry Center, Friedrich-Alexander Universität Erlangen-Nürnberg, Erlangen, 91052, Germany

2. Institute of Polymers and Composites, Hamburg University of Technology, Hamburg, 21073, Germany

3. Helmholtz-Zentrum Hereon, Institute of Surface Science, Geesthacht, 21502, Germany

4. Department of Materials Science and Engineering, Institute I, Friedrich-Alexander-Universität Erlangen-Nürnberg, Erlangen, 91052, Germany

5. Department of Chemistry and Pharmacy, Computer Chemistry Center, Friedrich-Alexander-Universität Erlangen-Nürnberg, Erlangen, 91052, Germany

Funder

Deutsche Forschungsgemeinschaft

H2020 European Research Council

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acspolymersau.1c00016

Reference44 articles.

1. Schlack, P. IG-Farbenindustrie, Preparation of Polyamides; 1938. German Patent 676 117; US Patent US 2,136,928.

2. Chemistry and Technology of Epoxy Resins

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