Molecular Approach To Enhance Thermal Conductivity in Electrically Conductive Adhesives
Author:
Affiliation:
1. Department of Chemistry, National Sun Yat-sen University, Kaohsiung, Taiwan 80424
Funder
Ministry of Science and Technology, Taiwan
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,Electrochemistry,Electronic, Optical and Magnetic Materials
Link
https://pubs.acs.org/doi/pdf/10.1021/acsaelm.9b00401
Reference63 articles.
1. Surface Functionalized Silver Nanoparticles for Ultrahigh Conductive Polymer Composites
2. Effects of coupling agents on the properties of epoxy-based electrically conductive adhesives
3. In situ preparation and sintering of silver nanoparticles for low-cost and highly reliable conductive adhesive
4. One-Step Preparation of Silver Hexagonal Microsheets as Electrically Conductive Adhesive Fillers for Printed Electronics
5. Low-Temperature Fusible Silver Micro/Nanodendrites-Based Electrically Conductive Composites for Next-Generation Printed Fuse-Links
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