Perfluoroalkylsilane-Modified Boron Nitride Nanosheets for Epoxy Composites with Improved Thermal Conductivity and Dielectric Performance-Reference-Cited by-同舟云学术

Perfluoroalkylsilane-Modified Boron Nitride Nanosheets for Epoxy Composites with Improved Thermal Conductivity and Dielectric Performance

Published:2022-12-02 Issue:1 Volume:5 Page:644-653
ISSN:2637-6105
Container-title:ACS Applied Polymer Materials
language:en
Short-container-title:ACS Appl. Polym. Mater.

Author:

Huang Zixin¹,Yang Ruirui²,Zheng Xiangdan¹,Jiang Qiuran¹^ORCID,Zhang Liying¹^ORCID,Liu Wanshuang¹^ORCID

Affiliation:

1. Shanghai High Performance Fibers and Composites Center (Province-Ministry Joint), Center for Civil Aviation Composites, College of Textiles, Donghua University, 2999 North Renmin Road, 201620Shanghai, China

2. Luoyang Ship Material Research Institute, 169 South Binhe Road, 471023Luoyang, China

Funder

Fundamental Research Funds of Shanghai Collaborative Innovation Center of High-Performance Fibers and Composites (Province-Minitry Joint)

Publisher

American Chemical Society (ACS)

Subject

Organic Chemistry,Polymers and Plastics,Process Chemistry and Technology

Link

https://pubs.acs.org/doi/pdf/10.1021/acsapm.2c01702

Reference49 articles.

1. Emerging challenges and materials for thermal management of electronics

2. Densification: A Route towards Enhanced Thermal Conductivity of Epoxy Composites

3. Enhanced thermal conductivity of benzoxazine nanocomposites based on non-covalent functionalized hexagonal boron nitride

4. Epoxy nanocomposites with high thermal conductivity and low loss factor: Realize 3D thermal conductivity network at low content through core-shell structure and micro-nano technology

5. Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Epoxy composite films of superior dielectric properties promoted by active ester hardeners for applications in electronic packaging;European Polymer Journal;2024-11

2. Enhanced thermal conductivity and mechanical properties of BN@polymethylacrylimide/epoxy composites with self-assembled stable 3D network;Chinese Journal of Chemical Engineering;2024-08

3. Enhanced thermal conductivity of epoxy resin by incorporating three-dimensional boron nitride thermally conductive network;The Journal of Chemical Physics;2024-04-16

4. Meliorative dielectric properties in core@double-shell structured Al@Al2O3@PDA/PVDF nanocomposites via decoupling the intra-particle polarization and inter-particle polarization;Materials Today Energy;2024-04

5. Fast Degradable and Thermally Conductive Silicone Rubber Vitrimer with Low Dielectric and UV‐Shielding Properties;Macromolecular Chemistry and Physics;2023-10-30