Pea-Pod-like Carbon Microspheres Encapsulated by Graphene-like Carbon Nitride for Enhanced Thermal Conductivity in Polyimide Films-Reference-Cited by-同舟云学术

Pea-Pod-like Carbon Microspheres Encapsulated by Graphene-like Carbon Nitride for Enhanced Thermal Conductivity in Polyimide Films

Author:

Liu Shuaishuai¹²³,Wang Yanyan²³,Xiao Chao²³,Jiang Miao²³,Ding Xin²³,Zhang Hui¹^ORCID,Zheng Kang²³^ORCID,Chen Lin²³,Tian Xingyou²³,Zhang Xian²³^ORCID

Affiliation:

1. School of Materials Science & Engineering, Anhui University, Hefei 230601, People’s Republic of China

2. Institute of Solid State Physics, Hefei Institutes of Physical Science, Chinese Academy of Sciences, Hefei 230031, People’s Republic of China

3. Key Laboratory of Photovoltaic and Energy Conservation Materials, Chinese Academy of Sciences, Hefei 230088, People’s Republic of China

Funder

Hefei Institutes of Physical Science, Chinese Academy of Sciences

National Natural Science Foundation of China

Anhui Province

Publisher

American Chemical Society (ACS)

Subject

Organic Chemistry,Polymers and Plastics,Process Chemistry and Technology

Link

Reference48 articles.

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