Dual‐Effect Coupling for Superior Dielectric and Thermal Conductivity of Polyimide Composite Films Featuring “Crystal‐Like Phase” Structure

Author:

Dong Xiaodi12,Wan Baoquan12,Zheng Ming‐Sheng12,Huang Langbiao3,Feng Yang4,Yao Ruifeng4,Gao Jinghui4,Zhao Quan‐Liang3,Zha Jun‐Wei12ORCID

Affiliation:

1. Beijing Advanced Innovation Center for Materials Genome Engineering School of Chemistry and Biological Engineering University of Science and Technology Beijing Beijing 100083 China

2. Shunde Innovation School University of Science and Technology Beijing Foshan 528300 China

3. School of Mechanical and Materials Engineering North China University of Technology Beijing 100144 China

4. State Key Laboratory of Electrical Insulation and Power Equipment Xi'an Jiao Tong University Xi'an 710049 China

Abstract

AbstractTo match the increasing miniaturization and integration of electronic devices, higher requirements are put on the dielectric and thermal properties of the dielectrics to overcome the problems of delayed signal transmission and heat accumulation. Here, a 3D  porous thermal conductivity network is successfully constructed inside the polyimide (PI) matrix by the combination of ionic liquids (IL) and calcium fluoride (CaF2) nanofillers, motivated by the bubble‐hole forming orientation force. Benefiting from the 3D thermal network formed by IL as a porogenic template and “crystal‐like phase” structures induced by CaF2‐ polyamide acid charge transfer, IL‐10 vol% CaF2/PI porous film exhibits a low permittivity of 2.14 and a thermal conductivity of 7.22 W m−1 K−1. This design strategy breaks the bottleneck that low permittivity and high thermal conductivity in microelectronic systems are difficult to be jointly controlled, and provides a feasible solution for the development of intelligent microelectronics.

Funder

National Natural Science Foundation of China

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

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