Nanosoldering Carbon Nanotube Junctions by Local Chemical Vapor Deposition for Improved Device Performance-Reference-Cited by-同舟云学术

Nanosoldering Carbon Nanotube Junctions by Local Chemical Vapor Deposition for Improved Device Performance

Published:2013-11-14 Issue:12 Volume:13 Page:5844-5850
ISSN:1530-6984
Container-title:Nano Letters
language:en
Short-container-title:Nano Lett.

Author:

Do Jae-Won¹,Estrada David¹,Xie Xu¹,Chang Noel N.¹,Mallek Justin¹,Girolami Gregory S.¹,Rogers John A.¹,Pop Eric¹,Lyding Joseph W.¹

Affiliation:

1. Department of Electrical and Computer Engineering, ‡Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, §Department of Chemistry, ∥Micro and Nanotechnology Laboratory, ⊥Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana−Champaign, Urbana, Illinois 61801, United States

Publisher

American Chemical Society (ACS)

Subject

Mechanical Engineering,Condensed Matter Physics,General Materials Science,General Chemistry,Bioengineering

Link

https://pubs.acs.org/doi/pdf/10.1021/nl4026083

Reference53 articles.

1. Reduction of hysteresis for carbon nanotube mobility measurements using pulsed characterization

2. Thermal dissipation and variability in electrical breakdown of carbon nanotube devices

3. Arrays of single-walled carbon nanotubes with full surface coverage for high-performance electronics

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