3-Mercapto-1-Propanesulfonate for Cu Electrodeposition Studied by in Situ Shell-Isolated Nanoparticle-Enhanced Raman Spectroscopy, Density Functional Theory Calculations, and Cyclic Voltammetry
Author:
Affiliation:
1. Department of Chemistry, University of Illinois at Urbana−Champaign, 600 South Mathews Avenue, Urbana, Illinois 61801, United States
2. Atotech Deutschland GmbH, R&D Electronics, 10553 Berlin, Germany
Funder
University of Illinois at Urbana-Champaign
Atotech Deutschland GmbH
Graduate College, University of Illinois at Urbana-Champaign
Publisher
American Chemical Society (ACS)
Subject
Surfaces, Coatings and Films,Physical and Theoretical Chemistry,General Energy,Electronic, Optical and Magnetic Materials
Link
https://pubs.acs.org/doi/pdf/10.1021/acs.jpcc.5b06274
Reference84 articles.
1. Via-filling using electroplating for build-up PCBs
2. Damascene copper electroplating for chip interconnections
3. Through silicon via: From the CMOS imager sensor wafer level package to the 3D integration
4. Superconformal Electrodeposition in Submicron Features
5. Theory of Filling of High-Aspect Ratio Trenches and Vias in Presence of Additives
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