Selective Deposition of Copper on Self-Assembled Block Copolymer Surfaces via Physical Vapor Deposition-Reference-Cited by-同舟云学术

Selective Deposition of Copper on Self-Assembled Block Copolymer Surfaces via Physical Vapor Deposition

Published:2021-10-27 Issue:44 Volume:13 Page:52931-52937
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Lee Sangho¹²^ORCID,Lee Wonmoo¹³,Jung Hee-Tae³^ORCID,Ross Caroline A.¹^ORCID

Affiliation:

1. Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States

2. Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States

3. Department of Chemical and Biomolecular Engineering (BK-21 Plus), Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, South Korea

Funder

Samsung

Semiconductor Research Corporation

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.1c15272

Reference50 articles.

1. Block Copolymer Lithography: Periodic Arrays of ~10 11 Holes in 1 Square Centimeter

2. Nanoscopic Templates from Oriented Block Copolymer Films

3. Evolution of Block Copolymer Lithography to Highly Ordered Square Arrays

4. A Path to Ultranarrow Patterns Using Self-Assembled Lithography

5. Morphology Control in Block Copolymer Films Using Mixed Solvent Vapors

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