Impact of Copper Intercalation on Thermoelectric Properties in Polyol Method-Prepared CuxBi2Se3, x = 0, 0.05, 0.10, and 0.15 Nanosheets

Author:

Mukherjee Bodhoday1ORCID,Tarachand 2,Lakhani Archana1ORCID,Okram Gunadhor Singh1ORCID,Kuo Yung-Kang3

Affiliation:

1. UGC−DAE Consortium for Scientific Research, University Campus, Khandwa Road, Indore 452001, Madhya Pradesh, India

2. National Institute for Materials Science, Tsukuba, Ibaraki 305-0044, Japan

3. Department of Physics, National Dong Hwa University, Hualien 97401, Taiwan

Funder

UGC-DAE?Consortium for Scientific Research, University Grants Commission

Publisher

American Chemical Society (ACS)

Subject

Electrical and Electronic Engineering,Materials Chemistry,Electrochemistry,Energy Engineering and Power Technology,Chemical Engineering (miscellaneous)

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