CuI: A Promising Halide for Thermoelectric Applications below 373 K-Reference-Cited by-同舟云学术

CuI: A Promising Halide for Thermoelectric Applications below 373 K

Published:2022-08-02 Issue:8 Volume:5 Page:10177-10186
ISSN:2574-0962
Container-title:ACS Applied Energy Materials
language:en
Short-container-title:ACS Appl. Energy Mater.

Author:

Almasoudi M.¹²,Saeed Abdu¹^ORCID,Salah Numan³⁴^ORCID,Alshahrie Ahmed¹⁴,Hasan P. M. Z.⁴,Melaibari A.⁴⁵,Koumoto Kunihito⁴⁶

Affiliation:

1. Department of Physics, Faculty of Science, King Abdulaziz University, Jeddah 21589, Saudi Arabia

2. Department of Physics, Al-Qunfudah University College, Umm Al-Qura University, Makkah 21955, Saudi Arabia

3. K. A. CARE Energy Research and Innovation Center, King Abdulaziz University, Jeddah 21589, Saudi Arabia

4. Center of Nanotechnology, King Abdulaziz University, Jeddah 21589, Saudi Arabia

5. Mechanical Engineering Department, Faculty of Engineering, King Abdulaziz University, Jeddah 21589, Saudi Arabia

6. Nagoya Industrial Science Research Institute, Nagoya 464-0819, Japan

Funder

King Abdulaziz University

King Abdullah City for Atomic and Renewable Energy

Publisher

American Chemical Society (ACS)

Subject

Electrical and Electronic Engineering,Materials Chemistry,Electrochemistry,Energy Engineering and Power Technology,Chemical Engineering (miscellaneous)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsaem.2c01929

Reference55 articles.

1. Defect-Controlled Copper Iodide: A Promising and Ecofriendly Thermoelectric Material

2. Complex thermoelectric materials

3. Boosting thermoelectric performance of SnTe by selective alloying and band tuning

4. Preparation of flexible ultra-fine Al2O3 fiber mats via the solution blowing method

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Development, experimental and simulated performance of copper iodide (γ-CuI) uni-track thin film thermoelectric modules;Applied Surface Science;2024-03

2. Doping-induced structural and optical modifications in γ-CuI nanocrystals;Journal of Physics and Chemistry of Solids;2024-01

3. Thermoelectric Sensor with CuI Supported on Rough Glass;Nanomaterials;2024-01-01

4. Limits to Hole Mobility and Doping in Copper Iodide;Chemistry of Materials;2023-10-25

5. Effect of grain boundary scattering on carrier mobility and thermoelectric properties of tellurium incorporated copper iodide thin films;Surfaces and Interfaces;2023-10