Dynamic Scaling Exponents of Copper Electrodeposits from Scanning Force Microscopy Imaging. Influence of a Thiourea Additive on the Kinetics of Roughening and Brightening-Reference-Cited by-同舟云学术

Dynamic Scaling Exponents of Copper Electrodeposits from Scanning Force Microscopy Imaging. Influence of a Thiourea Additive on the Kinetics of Roughening and Brightening

Published:1998-04-01 Issue:9 Volume:14 Page:2515-2524
ISSN:0743-7463
Container-title:Langmuir
language:en
Short-container-title:Langmuir

Author:

Mendez S.¹,Andreasen G.¹,Schilardi P.¹,Figueroa M.¹,Vázquez L.¹,Salvarezza R. C.¹,Arvia A. J.¹

Affiliation:

1. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas (INIFTA), Sucursal 4, Casilla de Correo 16, (1900) La Plata, Argentina

Publisher

American Chemical Society (ACS)

Subject

Electrochemistry,Spectroscopy,Surfaces and Interfaces,Condensed Matter Physics,General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/la970362t

Reference64 articles.

1. The growth of rough surfaces and interfaces

2. Salvarezza, R. C.; Arvia, A. J. InModern Aspects of Electrochemistry; Conway, B. E., Bockris J. O'M., White, R. E., Eds.; Plenum Press: New York, 1996; Vol. 28, Chapter 5, p 289.

3. Kinetic roughening phenomena, stochastic growth, directed polymers and all that. Aspects of multidisciplinary statistical mechanics

4. Self-Affine Fractal Vapour-Deposited Gold Surfaces Characterization by Scanning Tunnelling Microscopy

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