Solution Reactions of a Bis(pyrrolylaldiminate)copper(II) Complex with Peralkyl Zinc, Aluminum, and Boron Reagents: Investigation of the Pathways Responsible for Copper Metal Deposition-Reference-Cited by-同舟云学术

Solution Reactions of a Bis(pyrrolylaldiminate)copper(II) Complex with Peralkyl Zinc, Aluminum, and Boron Reagents: Investigation of the Pathways Responsible for Copper Metal Deposition

Published:2010-08-11 Issue:17 Volume:22 Page:4854-4866
ISSN:0897-4756
Container-title:Chemistry of Materials
language:en
Short-container-title:Chem. Mater.

Author:

Vidjayacoumar Balamurugan¹,Emslie David J. H.¹,Blackwell James M.²,Clendenning Scott B.²,Britten James F.¹

Affiliation:

1. Department of Chemistry, McMaster University, 1280 Main Street West, Hamilton, Ontario L8S 4M1, Canada

2. Intel Corporation, RA3-252, 2501 Northwest 229th Avenue, Hillsboro, Oregon 97124

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,General Chemical Engineering,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/cm101443x

Reference71 articles.

1. Atomic layer deposition of metal and nitride thin films: Current research efforts and applications for semiconductor device processing

2. Atomic Layer Deposition Chemistry: Recent Developments and Future Challenges

3. Advanced electronic and optoelectronic materials by Atomic Layer Deposition: An overview with special emphasis on recent progress in processing of high-k dielectrics and other oxide materials

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