Steady-state heat conduction analysis for two-terminal microwave oscillator devices with rectangular integral heat sinks

Abstract

The outline of a theoretical analysis to calculate the steady-state temperature distribution within a rectangular prism mounted on a semi-infinite heat sink is presented. The incident heat flux is uniform over a given centralized circular region on one face of the prism. The thermal conductivity of the material is treated as being dependent on the temperature. The model is used to calculate the maximum temperature rise within a heat sink configuration that is used to package contemporary two-terminal microwave oscillator devices. Results are presented that show how the maximum temperature rise within such commercially available heat sink packages depends on the input heat flux and the dimensions and thermal conductivity of the materials. These results are presented in a generalized form for device design purposes.