Electrical and Electrochemical Migration Characteristics of Ag/Cu Nanopaste Patterns-Reference-Cited by-同舟云学术

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Electrical and Electrochemical Migration Characteristics of Ag/Cu Nanopaste Patterns

Published:2014-12-01 Issue:12 Volume:14 Page:8915-8919
ISSN:1533-4880
Container-title:Journal of Nanoscience and Nanotechnology
language:en
Short-container-title:j nanosci nanotechnol

Author:

Koh Minkwan,Kim Kwang-Seok,Park Bum-Geun,Jung Kwang-Ho,Lee Caroline S.,Choa Yong-Ho,Jeong Myung Yung,Jung Seung-Boo

Publisher

American Scientific Publishers

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Evaluating electrochemical migration behavior of sintered nano-Ag: factors of bias voltage, electrode spacing, sinter process parameters, and NaCl concentration;Journal of Materials Science: Materials in Electronics;2023-10

2. Electrochemical Migration Mechanism of Cu@Ag Composite Preforms by Electromagnetic Compaction for Power Electronics;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

3. Reliability and Failure Mechanisms of Sintered Silver as Die Attach Joint;Die-Attach Materials for High Temperature Applications in Microelectronics Packaging;2019

4. Characterization of Electroless-Deposited Ternary M1M2-R (M1 = Co, Ni, M2 = W, Mo, R = P, B) Nano Thin Film for Optical-Sensor Interconnects;Science of Advanced Materials;2017-11-01

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