Development and Applications of 3-Dimensional Integration Nanotechnologies-Reference-Cited by-同舟云学术

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Development and Applications of 3-Dimensional Integration Nanotechnologies

Published:2014-02-01 Issue:2 Volume:14 Page:2001-2011
ISSN:1533-4880
Container-title:Journal of Nanoscience and Nanotechnology
language:en
Short-container-title:j. nanosci. nanotech.

Author:

Kim Areum,Choi Eunmi,Son Hyungbin,Pyo Sung Gyu

Publisher

American Scientific Publishers

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. 基于主动红外激励的硅通孔内部多缺陷分类与定位;Laser & Optoelectronics Progress;2024

2. Equivalent Modeling of Microbump Layer in Microsystem for Thermal Analysis Based on Differential Idea;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-09

3. Numerical simulation of the copper electroplating of TSV with additives under megasound effect;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

4. Microsystems using three-dimensional integration and TSV technologies: Fundamentals and applications;Microelectronic Engineering;2019-04

5. Etching Characteristics of Graphene Film for Electronic Devices Using Inductively Coupled Plasma;Journal of Nanoscience and Nanotechnology;2016-11-01

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