Affiliation:
1. School of Information Engineering, Shanghai Zhongqiao Vocational and Technical University, Shanghai, 200000, China
Abstract
As an imperative part of information technology, photoelectric information technology is widely applied in smart phones, mobile computers, portable electronic products, medical care, and industrial technology. In this research, a high-precision infrared photoelectric sensor is designed,
which utilizes XDU3093 chip as a built-in photoelectric sensor. The chip has the characteristics of high-power supply rejection ratio and temperature compensation. Then, the focus is on the design of infrared driving module and infrared detection module. Among them, the pulse current of the
infrared drive module is more than 100 mA, and the output current is in the form of square wave. To control noise, an isolation circuit between the infrared drive and other modules is set. Infrared detection involves photoelectric sensor. The nwell diode in CMOS process is utilized as photosensitive
diode, and at the same time, the surface of the diode is coated to ensure that only infrared light can generate photocurrent through coating. In the experiment, the infrared driver is simulated, and the results show that the driver module can effectively amplify the collected infrared signals,
and the detection accuracy reaches 0.2 V. The simulation of infrared detection suggests that there is a linear relationship between photocurrent and background infrared illumination, and the photocurrent decreases with the increase of distance. The designed infrared photoelectric sensor is
applied in the soft package counting link of workshop management. The infrared photoelectric acquisition signal is converted into an analog voltage signal, which is processed by the voltage conversion circuit and then transferred to the single chip microcomputer and software module. After
the data is uploaded to the upper computer through the serial port, it shows that the number of soft packages can be accurately identified in the workshop soft package counting link based on the designed infrared photoelectric sensor.
Publisher
American Scientific Publishers
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
1 articles.
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