Electrochemical Polishing of Cu Redistribution Layers for Fan-Out Wafer Level Packaging
Author:
Affiliation:
1. Department of Advanced Material Science & Engineering, Hanyang University, Ansan-si, Gyeonggi-do, 15588, Republic of Korea
2. Department of Material Science & Engineering, Hanyang University, Ansan-si, Gyeonggi-do, 15588, Republic of Korea
Publisher
American Scientific Publishers
Subject
Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Review—Principles and Applications of Electrochemical Polishing;Journal of The Electrochemical Society;2024-09-02
2. Selective Copper Electrodeposition for Redistribution Layer by Varying Concentration and Agitation of Janus Green B;ECS Journal of Solid State Science and Technology;2023-11-01
3. A new polishing method for complex structural parts: Moist particle electrolyte electrochemical mechanical polishing (MPE-ECMP);Electrochemistry Communications;2023-05
4. Copper-to-Copper Direct Bonding Process Using Current-Induced Enhancement Method;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
5. Shape Control of Metal Nanostructures by Electrodeposition and their Applications in Electrocatalysis;Journal of The Electrochemical Society;2022-11-01
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