Ultra-Low-<I>k</I> Thin Films of Polyhedral Oligomeric Silsesquioxane/Epoxy Nanocomposites via Covalent Layer-by-Layer Assembly-Reference-Cited by-同舟云学术

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Ultra-Low-k Thin Films of Polyhedral Oligomeric Silsesquioxane/Epoxy Nanocomposites via Covalent Layer-by-Layer Assembly

Published:2009-03-01 Issue:3 Volume:9 Page:1839-1843
ISSN:1533-4880
Container-title:Journal of Nanoscience and Nanotechnology
language:en
Short-container-title:J. Nanosci. Nanotech.

Author:

Liu Ying-Ling,Liu Chuan-Shun,Chen Wei-Hong,Chen Shi-Yi,Wang Ko-Shung,Hwu Ming-Jyh

Publisher

American Scientific Publishers

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Recent Advances of Polymer–POSS Nanocomposites With Low Dielectric Constant;Macromolecular Rapid Communications;2024-02-07

2. Dielectric properties and applications of POSS-polymer nanocomposites;Polyhedral Oligomeric Silsesquioxane (POSS) Polymer Nanocomposites;2021

3. Nanoprotective Layer-by-Layer Coatings with Epoxy Components for Enhancing Abrasion Resistance: Toward Robust Multimaterial Nanoscale Films;ACS Nano;2013-10-01

4. Growth and fire protection behavior of POSS-based multilayer thin films;Journal of Materials Chemistry;2011

5. Bionanohybrid Based on Bioplastic and Surface-Functionalized Carbon Nanotubes;Journal of Nanoscience and Nanotechnology;2010-12-01

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