Experimental Investigation of Thermal Conduction in Copper-Palladium Nanofluids-Reference-Cited by-同舟云学术

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Experimental Investigation of Thermal Conduction in Copper-Palladium Nanofluids

Published:2016-08-01 Issue:4 Volume:5 Page:496-501
ISSN:2169-432X
Container-title:Journal of Nanofluids
language:en
Short-container-title:J Nanofluids

Author:

Jaiswal Aashit Kumar,Wan Meher,Singh Satyendra,Singh D. K.,Yadav R. R.,Singh Devraj,Mishra Giridhar

Publisher

American Scientific Publishers

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Improvement of thermal performance through nanofluids in industrial applications: A review on technical aspects;Materials Today: Proceedings;2024-04

2. Evaluation of Stability and Enhancement of Nano Fluid Methods;Journal of Physics: Conference Series;2024-01-01

3. Synthesis of nanofluids preparation – A review;Materials Today: Proceedings;2023-09

4. Noble Nanofluids and Their Hybrids for Heat Transfer Enrichment: A Review and Future Prospects Coverage;Applied Sciences;2023-08-24

5. Studies on the Functional Properties of Titanium Dioxide Nanoparticles Distributed in Silyl–Alkyl Bridged Polyaniline-Based Nanofluids;Nanomaterials;2023-08-14

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