Random Vibration Fatigue Life Prediction of Nano-Silver Solder Joint

Abstract

Nano-silver is a very potential electronic interconnection material. It’s excellent physical and chemical properties, high thermal conductivity and good electrical conductivity make it very suitable for high power electronic devices. In practical engineering, 20% of the failure of electronic products is caused by vibration load, so it is necessary to study the vibration reliability of interconnected materials. In this paper, the modal and random vibration finite element analysis of nano-silver solder joints were analyzed with workbench software. Predicting random vibration fatigue life of nano-silver solder joint by Coffin-Manson high cycle fatigue empirical formula, Miner’s linear cumulative damage theory and Steinberg model. The random vibration fatigue life of the nanosilver solder joint is 8342 h. It is found that the vibration reliability of nano-silver is inferior to Sn3.0Ag0.5Cu and Sn63Pb37 and the diameter of solder joints and PCB thickness are proportional to the vibration fatigue life, and the PCB thickness has a greater effect on the vibration life than the solder joint diameter. Solder joint height and pad thickness are inversely proportional to vibration fatigue life, and pad thickness has little effect on vibration fatigue life.